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    Results for "BGA Publications Books"
    BGA Publications Books
    12 results
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    Nonfiction (6)
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    Science (3)
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    All Sellers
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      12 results
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      Here to Help (UFOs and the Space Brothers)
      By Aartsen, Gerard
      Here to Help (UFOs and the Space Brothers)
      By Aartsen, Gerard
      $26.68
      Before Disclosure (Dispelling the Fog of Speculation)
      By Aartsen, Gerard
      Before Disclosure (Dispelling the Fog of Speculation)
      By Aartsen, Gerard
      $14.74
      George Adamski - Letters ­to Emma Martinelli
      By Adamski, George, Aartsen, Gerard
      George Adamski - Letters ­to Emma Martinelli
      By Adamski, George, Aartsen, Gerard
      $19.32
      The Sea of Consciousness (George Adamski's lost debut - The Invisible Ocean)
      By Aartsen, Gerard, Adamski, George
      The Sea of Consciousness (George Adamski's lost debut - The Invisible Ocean)
      By Aartsen, Gerard, Adamski, George
      $18.96
      Microvias (Low Cost, High Density Interconnects (Electronic Packaging and Interconnection))
      By John H. Lau, Ricky S. W. Lee
      Microvias (Low Cost, High Density Interconnects (Electronic Packaging and Interconnection))
      By John H. Lau, Ricky S. W. Lee
      $233.48 Elsewhere $264.95 Save $31.47 (12%)
      New or Used: $233.48
      Advanced MEMS Packaging
      By Lau, John H., Lee, Cheng Kuo, C. S. Premachandran, Yu Aibin
      Advanced MEMS Packaging
      By Lau, John H., Lee, Cheng Kuo, C. S. Premachandran, Yu Aibin
      $408.51
      New or Used: $408.51
      Reliability of ­RoHS-Compliant 2D and 3D ­IC Interconnects
      By Lau, John H.
      Reliability of ­RoHS-Compliant 2D and 3D ­IC Interconnects
      By Lau, John H.
      $343
      New or Used: $346.14
      Through-Silicon Vias for 3D­ Integration
      By John H. Lau
      Through-Silicon Vias for 3D­ Integration
      By John H. Lau
      $440
      New or Used: $376.38
      3D IC Integration and ­Packaging (Electronics)
      By Lau, John H.
      3D IC Integration and ­Packaging (Electronics)
      By Lau, John H.
      $500
      Ball Grid Array Technology ­ (Electronic Packaging and Interconnection)
      By John H. Lau
      Ball Grid Array Technology ­ (Electronic Packaging and Interconnection)
      By John H. Lau
      Currently
      Unavailable
      Flip Chip Technologies (Electronic Packaging and Interconnection)
      By Lau, John H.
      Flip Chip Technologies (Electronic Packaging and Interconnection)
      By Lau, John H.
      Currently
      Unavailable
      5th ICEG - Environmental ­Geotechnics (Opportunities, Challenges and Responsibilities for Environmental Geotechnics)
      By Hywel R. Thomas
      5th ICEG - Environmental ­Geotechnics (Opportunities, Challenges and Responsibilities for Environmental Geotechnics)
      By Hywel R. Thomas
      Currently
      Unavailable