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Microvias (Low Cost, High Density Interconnects (Electronic Packaging and Interconnection))
By
John H. Lau
,
Ricky S. W. Lee
Microvias (Low Cost, High Density Interconnects (Electronic Packaging and Interconnection))
By
John H. Lau
,
Ricky S. W. Lee
$233.48
Elsewhere
$264.95
Save $31.47 (12%)
New or Used
:
$233.48
Advanced MEMS Packaging
By
Lau, John H.
,
Lee, Cheng Kuo
,
C. S. Premachandran
,
Yu Aibin
Advanced MEMS Packaging
By
Lau, John H.
,
Lee, Cheng Kuo
,
C. S. Premachandran
,
Yu Aibin
$408.51
New or Used
:
$408.51
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
By
Lau, John H.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
By
Lau, John H.
$344
New or Used
:
$346.14
Through-Silicon Vias for 3D Integration
By
John H. Lau
Through-Silicon Vias for 3D Integration
By
John H. Lau
$375
New or Used
:
$376.38
3D IC Integration and Packaging (Electronics)
By
Lau, John H.
3D IC Integration and Packaging (Electronics)
By
Lau, John H.
$500
Ball Grid Array Technology (Electronic Packaging and Interconnection)
By
John H. Lau
Ball Grid Array Technology (Electronic Packaging and Interconnection)
By
John H. Lau
Currently
Unavailable
Flip Chip Technologies (Electronic Packaging and Interconnection)
By
Lau, John H.
Flip Chip Technologies (Electronic Packaging and Interconnection)
By
Lau, John H.
Currently
Unavailable
5th ICEG - Environmental Geotechnics (Opportunities, Challenges and Responsibilities for Environmental Geotechnics)
By
Hywel R. Thomas
5th ICEG - Environmental Geotechnics (Opportunities, Challenges and Responsibilities for Environmental Geotechnics)
By
Hywel R. Thomas
Currently
Unavailable